Dell PowerEdge R660 デュアル Xeon ゴールド 6542Y | 64 GB DDR5 | PERC H755 | 1.92 TB SSD | 1,800W 冗長電源ユニット
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  • 品番:Dell PowerEdge R660
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Title

Dell PowerEdge R660 Dual Xeon Gold 6542Y | 64 GB DDR5 | PERC H755 | 1.92 TB SSDs | 1,800W Redundant PSU

Keywords

Dell PowerEdge R660, Xeon Gold 6542Y, 64 GB DDR5-5600, PERC H755 RAID, 1.92 TB SSD, dual 1800W PSU, Broadcom 57414 10/25GbE NIC, iDRAC9 Enterprise

Description

This configuration of the Dell PowerEdge R660 is a robust, enterprise-grade server built for compute, storage, and network intensive workloads.

As per Dell’s spec sheet, R660 supports dual next-generation Intel Xeon Scalable CPUs, up to 10 front 2.5″ drive bays, and integrated management features. 

Your system is equipped with **dual Intel Xeon Gold 6542Y** processors (24 cores / 48 threads, DDR5-5200 support, 250W TDP).

The “Performance Heatsink for 2 CPU” setting is used to support higher thermal budgets in this dual-CPU setup. The configuration explicitly states “No HBM” (no High Bandwidth Memory), so standard memory channels are used.

Memory in this build totals **16 × 64 GB DDR5-5600 RDIMM** (dual rank), which is a very high capacity configuration.

This supports memory-intensive tasks like large databases or in-memory caching. The “Performance Optimized” memory profile is applied to maximize throughput.

The storage controller is a **PERC H755** with rear load brackets. Two **1.92 TB SATA SSDs** (mixed use, 6 Gbps, 512e, hot-plug) are included.

The RAID configuration is currently “C7, Unconfigured RAID (mixed drive types allowed)” giving you flexibility to choose your RAID level (RAID 1, 5, 10, etc.).

On the networking side, you have a **Broadcom 57414 dual-port 10/25GbE OCP NIC**, plus a Broadcom 5720 dual 1GbE LOM and optionally an Intel i350 quad 1GbE adapter.

There's also a fibre channel HBA (Emulex LPe35002) included for SAN connectivity.

Power is backed by **dual 1,800W Titanium redundant (1+1) PSUs**, giving ample power overhead for heavy workloads. Cooling is handled via **4 very high performance fans**.

The system includes **iDRAC9 Enterprise 16G** for remote management and **TPM 2.0 V6** for platform security.

Key Features

  • Dual Intel Xeon Gold 6542Y (24C/48T each) for strong multi-threaded performance
  • High memory capacity: 16 × 64 GB DDR5-5600 RDIMMs
  • PERC H755 RAID controller with rear load bracket—support for mixed drives
  • Two 1.92 TB SATA SSDs (hot-plug) for fast storage I/O
  • Dual 1,800W Titanium redundant PSUs for high power headroom and reliability
  • Broadcom 57414 10/25GbE OCP NIC and additional networking options (1GbE, 4x1GbE, FC HBA)
  • iDRAC9 Enterprise, TPM 2.0 V6, and security / management features built in
  • ReadyRails sliding rails with Cable Management Arm, high-performance fans, and robust chassis design

Configuration

Module / PartSelected Option
BasePowerEdge R660 Server (210-BEQQ)
TPMTrusted Platform Module 2.0 V6
Chassis2.5″ chassis supporting up to 10 SAS/SATA drives, 2 CPU, PERC11 backplane
Processor 1Intel Xeon Gold 6542Y (24C/48T, DDR5-5200)
Processor 2Intel Xeon Gold 6542Y (same)
Processor FeatureNo HBM
Thermal ConfigurationPerformance Heatsink for ≥250W CPU configuration
Memory ProfilePerformance Optimized
Memory Type / SpeedRDIMM, 5600 MT/s
Memory Capacity16 × 64 GB modules (dual rank)
RAID ConfigurationC7: unconfigured RAID (mixed drive types allowed)
RAID ControllerPERC H755 with rear load bracket
Drives2 × 1.92 TB SATA SSD (6 Gbps, mixed use, hot-plug)
BIOS SettingPower Saving mode
Boot ModeUEFI GPT
Fans4 Very High Performance
PSUDual 1,800W Titanium redundant (1+1)
Power Cords2 × C15/14 2m PDU style
PCIe RiserRiser config 1, 3 × x16 LP (Gen4)
Motherboard ConstraintMLK board supports only CPUs < 250W
Network AdapterBroadcom 57414 dual 10/25GbE OCP NIC
Additional NICsBroadcom 5720 1GbE LOM, Intel i350 quad 1GbE
Fibre Channel AdapterEmulex LPe35002 32G FC HBA
Bezel / BOSS / OtherNo bezel, no BOSS card, no Quick Sync
Management / SecurityiDRAC9 Enterprise 16G, TPM 2.0 V6
Rails / Chassis AccessoriesReadyRails with CMA
Warranty / Deployment12-month parts only; ProDeploy services

Compatibility

The R660 supports dual Intel Xeon Scalable processors per Dell’s specifications. 

The “MLK” motherboard version you have is constrained to CPUs below 250W, which matches your choice of Gold 6542Y (TDP 250W) and disallows higher-TDP CPUs.

Memory support in R660 includes DDR5 RDIMMs. Dell’s spec sheet indicates support for DDR5 up to 4800 MT/s under certain DIMM population modes.

With 16 high-capacity modules you may not hit the top speed depending on slot population and memory topology.

The chassis option “2.5″ chassis with up to 10 drives” is one of the supported drive backplane options for R660.

This allows for a mix of SAS, SATA, or NVMe drives depending on your backplane configuration.

PERC H755 is a valid RAID controller in Dell’s server lineup; using the rear load bracket is consistent with backplane or cabling requirements. Mixed drive types (SAS/SATA) are supported per your RAID configuration option.

Network adapters (10/25GbE OCP, 1GbE, FC HBA) are typical expansions for these systems, provided the server has the proper PCIe / OCP slots and firmware support.

iDRAC9 Enterprise is natively supported on the R660 platform. 

Power supply options include Titanium efficiency modules up to high wattages.

Your dual 1,800W PSUs provide excellent headroom. Cooling with high performance fans aligns with CPU TDP selections and dense memory/drive configuration.

Usage Scenarios

1) Virtualization & Hosting: With dual 24-core CPUs, high memory capacity, and SSD storage, this server is well suited for running multiple virtual machines, containers, or hybrid cloud hosts.

2) Database / Analytics: Use the SSDs as fast data tier or log tier, while memory supports large in-memory caching. The compute cores help with heavy transaction workloads.

3) Storage / Cache Node: As part of a storage stack, this server can serve as a caching layer or front end, accelerating hot data paths.

4) High-Speed Networking Gateway: With 25GbE capability, it can act as a network bridge, firewall, or application gateway in demanding environments.

5) SAN / Fibre Channel Integration: The presence of FC HBA allows it to connect directly to SAN fabric—ideal for combining block I/O, compute, and storage functions in one node.

Frequently Asked Questions

  1. Q: Can I upgrade to a higher TDP CPU (e.g. > 250W) later?
    A: No — your motherboard (MLK variant) is constrained to CPUs under 250W, as indicated in your configuration. Attempting to install a higher TDP CPU may cause compatibility or thermal issues.
  2. Q: Will all 16 memory modules run at full 5600 MT/s?
    A: Probably not. In high population states, memory speed may drop depending on channel and DIMM distribution. You might see lower speeds depending on load and configuration.
  3. Q: What RAID level should I use for the two 1.92 TB SSDs?
    A: With two SSDs, RAID 1 (mirroring) is a common choice for redundancy. If you add more drives later, you could move into RAID 5 or RAID 10 for performance + protection.
  4. Q: Are there limitations on PCIe expansions with your chosen riser and OCP NIC?
    A: You have “riser config 1, Low Profile, 3 × x16 LP (Gen4)” and an OCP NIC 3.0 slot. This gives you flexibility, but be mindful of lane assignment, slot interference, and power delivery when adding high bandwidth cards.
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